| PART |
Description |
Maker |
| DB2431200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| DB2460100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| DB2460500L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| DB2130200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| MI1064 |
Thermo-electric Coolers
|
List of Unclassifed Manufacturers
|
| BM03B-ZESS-TBTLFSN |
ZE CONNECTOR EMBOSSED-TAPING
|
Lightel Technologies INC.
|
| GRM32ER61C226ME20L GRM32ER61C226ME20K |
φ180, 330mm Embossed taping
|
Murata Manufacturing Co., Ltd.
|
| LX1810 LX1810-CDB LX1810CDB |
ThermoElectric Cooler Drive Controller IC
Thermo Electric Controller IC
|
外设及接
MICROSEMI[Microsemi Corporation]
|
| 67492-1820 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220"), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 2
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.60mm (.220), Gold (Au) Flash, without Cap, Embossed Tape on Reel Packaging, 22Circuits, Lead Free
|
Molex Electronics Ltd.
|
| 0791098407 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
| 0791098402 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
